iPhone 7 May Use New Packaging Technology To Save Internal Space
Apple is expected to use a new "fan-out" packaging technology for some components to maximize the amount of room in the iPhone 7.
Thinner
Apple’s iPhone 7 May Feature Thinner, Waterproof Design With No Headphone Jack
Apple’s iPhone 7 may feature a thinner waterproof body with no headphone jack, in addition to wireless charging.