Taiwan Semiconductor Manufacturing Company has allegedly beaten Samsung and won exclusive orders from Apple to deliver A10 processors, according to supply chain sources speaking with Digitimes.
TSMC will offer its in-house developed backend integrated fan-out (InFO) wafer-level packaging for the production of the A10 chips, which will be built using the foundry’s 16nm FinFET process technology, said the report, which cited unspecified Apple suppliers as its source. The A10 will be featured in the iPhone 7 series slated for launch during the third and fourth quarters of 2016.
The mass production of the processor will kick off in March, and TSMC will adapt its 16 nm process and integrated fan-out (InFO) wafer-level packaging technologies, the sources whispered. It certainly looks as though Apple has started placing iPhone 7 orders, the first being for the processors, at least this is the first information leak regarding the next-generation iPhone (the iPhone 6s hasn’t even hit the stores yet).
TSMC also managed to obtain half of Apple’s total A9 chip orders for the devices Apple unveiled just last week during the “Hey Siri” media event.
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