iFixit Tears Down the iPhone 6, Includes Chips from Qualcomm and SK Hynix

The folks over at iFixit, who flew down to Australia to be one of the first to teardown the iPhone 6 Plus, have continued their iPhone 6 teardown to reveal chips from NXP, SK Hynix, Skyworks Solutions and other companies. Like previous iPhones, the iPhone 6 also uses a Qualcomm 4G LTE modem.

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Disassembling the iPhone 6 in a Mac repair shop, the experts also discovered a Murata (6981.T) wifi module, a Broadcom touchscreen controller, and chips from Avago and TriQuint. The NFC chip in the iPhone 6 Plus comes from NXP Semiconductors, in line with most investors’ expectations. NXP also supplies the iPhone’s motion co-processor, which is a key to making its sensors work without draining its battery.

The iPhone 6 features an 1810 mAh, 3.82 V Lithium-ion Polymer battery with an energy rating of 6.91 Wh. While its fair bit smaller than the iPhone 6 Plus’s 11.1 Wh, 2915 mAh battery, but still a notable bump from the 1560 mAh unit in the iPhone 5s.

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Highlights from the front side of the logic board:

  • Apple A8 APL1011 SoC + SK Hynix RAM as denoted by the markings H9CKNNN8KTMRWR-NTH (we presume it is 1 GB LPDDR3 RAM, the same as in the iPhone 6 Plus)
  • Qualcomm MDM9625M LTE Modem
  • Skyworks 77802-23 Low Band LTE PAD
  • Avago A8020 High Band PAD
  • Avago A8010 Ultra High Band PA + FBARs
  • SkyWorks 77803-20 Mid Band LTE PAD
  • InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo


The back side of the logic board includes:

  • SanDisk SDMFLBCB2 128 Gb (16 GB) NAND Flash
  • Murata 339S0228 Wi-Fi Module
  • Apple/Dialog 338S1251-AZ Power Management IC
  • Broadcom BCM5976 Touchscreen Controller
  • NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)
  • NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)
  • Qualcomm WTR1625L RF Transceiver

You can follow the teardown in detail at iFixit’s website here.