‘iPhone 7’ May Support Dual SIMs, Keep 3.5mm Headphone Jack
Last week, a leaked photo of alleged ‘iPhone 7’ components hinted that the next-generation iPhone would come in three different models, with one model supporting dual SIMs and also retaining the 3.5mm headphone jack. Today, more leaked images of alleged iPhone 7’s Lightning cable assembly shared by Engadget via Rock Fix, a smartphone repair shop based in China’s Ganzhou, show a headphone jack attached to it, alongside images of iPhone’s dual-SIM trays.
“The shop owner also told us that there will be some changes to the antenna design, though he clarified that this won’t get rid of those antenna bands on the back of the phone; maybe it’s more to do with the rumored switch to Intel’s modem for the GSM models”.
In addition to the above, other parts shown off by the Chinese repair shop’s leaked images include some screen panels in the usual two sizes i.e. 4.7-inch and a 5.5-inch, some SanDisk memory chips of up to 256GB, and a dual-lens camera for the larger model.
An industry insider has also recently claimed that Samsung, Oppo, Vivo and Xiaomi are also exploring dual-lens cameras for their upcoming flagship smartphones.