Apple Postpones Space-Saving RCC Components for Future iPhones

In a recent update, renowned analyst Ming-Chi Kuo has revealed that Apple has postponed its plans to incorporate resin-coated copper (RCC) components into future iPhone models (via 9to5Mac).

Initially expected to debut in the iPhone 16, the transition to RCC components was later deferred to the iPhone 17, and now, it appears to be delayed once again.

RCC technology, which was first discussed in a report by Kuo last October, has the potential to revolutionize the internal design of iPhones. By reducing the thickness of the mainboard, RCC components can create more internal space within the device.

This additional space could allow Apple to make the iPhone thinner or introduce new features without increasing the device’s size. Moreover, RCC’s fiberglass-free construction simplifies the drilling process, presenting a significant manufacturing advantage.

Despite the promising benefits, Apple and its suppliers have encountered significant hurdles in integrating RCC components. The primary concern has been the durability and fragility of the new materials. These issues have repeatedly delayed the adoption of RCC technology.

According to Kuo, the latest delay stems from the inability of RCC components to meet Apple’s stringent quality standards. As a result, the iPhone 17, slated for release in 2025, will not feature RCC mainboard materials.

更新： 因無法滿足Apple對品質的高標準要求，2025年新款iPhone 17將不採用RCC作為PCB主板材料。
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Update: Due to the inability to meet Apple’s high-quality requirements, the new iPhone 17 in 2025 will not use RCC as the PCB motherboard material. https://t.co/ZInZnDqQqZ

— 郭明錤 (Ming-Chi Kuo) (@mingchikuo)

July 17, 2024

Kuo’s latest report does not clarify whether RCC components might be introduced with the iPhone 18 in 2026 or if the delay will extend even further.