iPhone 18 Pro Chip Leak Reveals a Wild Interior Redesign

A freshly leaked image showing Apple’s purported next-generation A20 Pro chip for the upcoming iPhone 18 Pro reveals a drastic structural shift that could fix one of the biggest issues modern smartphones face (via MacRumors).

The new leak indicates that Apple is ditching the old method of stacking chips for the iPhone 18 Pro. Instead, the company is expected to use a layout called Wafer-Level Multi-Chip Module technology. To put it simply, Apple is moving the system memory off the top of the main chip and placing it right next to it on the side.

According to well-known online tipsters WHYLAB and Ice Universe, moving these parts side by side prevents them from sharing heat directly. This design should allow the iPhone to run at peak performance for much longer without getting uncomfortably warm in your hand. While the overall physical size of the piece remains similar to previous generations, sources note that one specific section has grown immensely.

The Neural Processing Unit, which is the dedicated brain responsible for handling artificial intelligence tasks, looks much larger than before. This visual change confirms that Apple is heavily focusing on hardware-powered AI capabilities for its future lineup.

The chip is also expected to benefit from an advanced two-nanometer manufacturing process. This design allows engineers to cram even more power into a microscopic space. Early estimates suggest this layout could make the device 15% faster while using 30% less battery energy than older models.

According to ongoing industry discussions, this advanced A20 Pro piece will be reserved for the premium models. This includes the iPhone 18 Pro, the iPhone 18 Pro Max, and Apple’s highly anticipated first foldable ‘iPhone Ultra.’