The folks over at iFixit, who flew down to Australia to be one of the first to teardown the iPhone 6 Plus, have continued their iPhone 6 teardown to reveal chips from NXP, SK Hynix, Skyworks Solutions and other companies. Like previous iPhones, the iPhone 6 also uses a Qualcomm 4G LTE modem.
Disassembling the iPhone 6 in a Mac repair shop, the experts also discovered a Murata (6981.T) wifi module, a Broadcom touchscreen controller, and chips from Avago and TriQuint. The NFC chip in the iPhone 6 Plus comes from NXP Semiconductors, in line with most investors’ expectations. NXP also supplies the iPhone’s motion co-processor, which is a key to making its sensors work without draining its battery.
The iPhone 6 features an 1810 mAh, 3.82 V Lithium-ion Polymer battery with an energy rating of 6.91 Wh. While its fair bit smaller than the iPhone 6 Plus’s 11.1 Wh, 2915 mAh battery, but still a notable bump from the 1560 mAh unit in the iPhone 5s.
Highlights from the front side of the logic board:
- Apple A8 APL1011 SoC + SK Hynix RAM as denoted by the markings H9CKNNN8KTMRWR-NTH (we presume it is 1 GB LPDDR3 RAM, the same as in the iPhone 6 Plus)
- Qualcomm MDM9625M LTE Modem
- Skyworks 77802-23 Low Band LTE PAD
- Avago A8020 High Band PAD
- Avago A8010 Ultra High Band PA + FBARs
- SkyWorks 77803-20 Mid Band LTE PAD
- InvenSense MP67B 6-axis Gyroscope and Accelerometer Combo
The back side of the logic board includes:
- SanDisk SDMFLBCB2 128 Gb (16 GB) NAND Flash
- Murata 339S0228 Wi-Fi Module
- Apple/Dialog 338S1251-AZ Power Management IC
- Broadcom BCM5976 Touchscreen Controller
- NXP LPC18B1UK ARM Cortex-M3 Microcontroller (also known as the M8 motion coprocessor)
- NXP 65V10 NFC module + Secure Element (likely contains an NXP PN544 NFC controller inside)
- Qualcomm WTR1625L RF Transceiver
You can follow the teardown in detail at iFixit’s website here.