iPhone 18 Reported to Use Enhanced 2nm Chip Featuring 12GB of RAM

Although it’s still a few years away, Apple’s iPhone 18 is expected to leverage Taiwan Semiconductor Manufacturing Company (TSMC)’s next-generation 2-nanometer fabrication process. The enhanced chipset is believed to feature 12GB of RAM.

According to a Weibo post (via MacRumors), a Chinese-language user “Phone Chip Expert” claimed that Apple’s 2028 iPhone 18 will transition away from InFo (Integrated Fan-Out) packaging to WMCM (Wafer-Level Multi-Chip Module) packaging. This would allow the theoretical A20 chipset to support 12GB of RAM.

The move to WMCM means the iPhone 18 could feature multiple chips within the same package, making it a multi-chip module. With this in mind, the reported A20 processor can support more complex CPUs, GPUs, and DRAM than other accelerators. This also allows for more flexible options to stack these chips either vertically or place them horizontally while not making any concessions to communication between each one.

This isn’t the first time we’ve heard that the iPhone 18 may feature a 2nm chipset process. Earlier last month, Apple analyst Ming-Chi Kuo predicted that iPhone 18 Pro models may use TSMC’s next-gen 2nm processor while next year’s iPhone 17 will only utilize enhanced N3P 3-nanometer chip tech. However, Kuo’s report states that only iPhone 18 Pro models may use 2nm chips “due to cost concerns.”

Across the board, all iPhone 16 models support 8GB of RAM, which is believed to be the minimum requirement for Apple Intelligence. However, earlier this year, Kuo stated that iPhone 17 Pro models may receive the bump to 12GB of RAM while the standard models will continue to support 8GB of RAM.