According to a new report by The Information’s Wayne Ma, Apple’s upcoming “iPhone 17 Air” expected to debut in 2025 is set to redefine iPhone aesthetics, with significant design changes (via MacRumors).
Prototypes of the rumoured device suggest a record-breaking thickness of just 5mm to 6mm. For comparison, the current iPhone 16 models measure 7.8mm, while the Pro versions are 8.25mm thick.
While this slim form factor aims to deliver a sleek and lightweight design but comes with notable compromises in hardware and features.
Today’s report claims that the iPhone 17 Air will eliminate the physical SIM card tray entirely, making it reliant on eSIM technology. While U.S. iPhones have already transitioned to eSIM-only designs starting with the iPhone 14, models sold in Canada and other regions still include a SIM card slot.
The upcoming change aligns with Apple’s broader efforts to streamline hardware and enhance waterproofing. However, the final decision on the inclusion of a physical SIM slot is reportedly still under consideration.
Another significant change is the audio system. Unlike its predecessors, which boast dual-speaker setups, the “iPhone 17 Air” will reportedly feature just one speaker integrated into the earpiece.
The iPhone 17 Air is also expected to debut Apple’s first in-house 5G modem, promising improved power efficiency and a smaller size. However, it will reportedly lack mmWave 5G support, resulting in slower cellular speeds compared to current Qualcomm modems.
Battery capacity is another area impacted by the thin design. While specifics on battery life are unavailable, the smaller battery could lead to shorter usage times. On the camera front, the device is rumored to feature a single, centralized rear camera—a significant departure from the dual and triple-camera systems
The iPhone 17 Air is currently in its early production phase at Foxconn. Apple is reportedly grappling with difficulties in accommodating components within the slim frame, particularly the battery.
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I wonder if it will also ditch the USB-C port and go full wireless. Seems like an Apple-y thing to do.
If it’s really going to be made that thin, people will be able to bend it just by looking at it. Never liked that trend to keep sacrificing the features and functionality at the altar of thinness. It has become a fetish and it doesn’t serve the purpose of making it a better, more functional product. It’s almost an irrational goal on its own.
I can't wait!