Nowhereelse.fr has leaked images of what they claim to be the printed circuit board for the iPhone 6. The images come from one of their Chinese sources, which they describe as “particularly reliable”.
As you can see from the image below, the design of the alleged iPhone 6 printed circuit board is similar to that of the iPhone 5S.
The article notes that the bracket on the top of the circuit board is longer than normal. Given that the iPhone 6 is rumoured to ship with a larger 4.7-inch screen, a larger bracket is to be expected.
The iPhone 6 is reportedly going to be identified under the reference N61. Nowhereelse.fr says that the motherboard is equipped with a near field communication (NFC) chip and a module that supports 802.11ac WiFi. Over the past several years we have seen many rumours that pointed to Apple finally including a near field communication chip in the iPhone, however it has yet to happen.
Apple is expected to announce two models of the iPhone 6 this year, one with a 4.7-inch display and another with a slightly larger 5.5-inch display. Both devices are rumoured to include the A8 CPU and come in at 6 millimetres thick. The 4.7-inch model is expected to ship this fall, with the 5.5-inch model expected to arrive towards the end of the year.
The 4.7-inch iPhone 6 will reportedly ship alongside the public release of iOS 8. The company is also expected to announced the long-rumoured health and fitness-focused iWatch, which will reportedly come in multiple sizes and include over 10 sensors.