Citing sources familiar with the South Korean company’s plans, a new report by Bloomberg is claiming that Samsung is looking to invest over $10 billion in an advanced chipmaking plant in Austin, Texas, with hopes to compete directly with Taiwan Semiconductor Manufacturing Co (TSMC).
The report notes that Samsung is in talks to locate a facility in the U.S. capable of fabricating chips as advanced as 3 nanometers in the future. The company is hoping to kick off construction this year, install major equipment next year, and then begin operations as early as 2023.
The South Korean smartphone maker is said to be taking advantage of the U.S. government’s efforts to counter China’s rising economic prowess and lure back home some of the advanced manufacturing.
The envisioned plant will be its first in the U.S. to use extreme ultraviolet lithography, the standard for next-generation silicon, the people said, asking not to be identified talking about internal deliberations. Asked about plans for a U.S. facility, Samsung said in an email no decision has yet been made.
If Samsung goes ahead with the investment, it would effectively go head-to-head on American soil with industry leader TSMC.