In line with previous rumours, Intel has managed to find a way to become an iPhone component supplier, Chipworks has confirmed. Just like iFixit and TechInsights (and other firms interested in what’s inside the latest iPhone), Chipworks has performed its own teardown to uncover the list of components and the names of component suppliers for the iPhone 7.
Intel seems to be a winner in this case, because it is supplying not just one, but two RF transceivers, the baseband modem and the (RF) power management IC, as noted by Chipworks. Although the guys are still waiting for some results of analysis, Chipworks has confirmed that the iPhone 7 Model A1778 they have dissected includes Intel’s Baseband Processor (Modem) PMB9943, which they suspect is the rumoured Intel XMM7360 modem, plus two Intel PMB5750s (or SMARTI 5 RF Transceivers).
A closer look at the A10 Fusion chip reveals that Apple has added a “W” in the part number, so it’s now APL1 W24, 339S00255 as opposed to the Apple A9, which was APL1022, 339S00129. The reason for this change is still unknown, as is the meaning of the “W”.
The A10 Fusion chip was supplied by TSMC, which doesn’t necessarily mean it’s the sole supplier of the chip, so the question remains as to whether or not Samsung received chip orders from Apple. You may recall that last year Apple used chips from both Samsung and TSMC, causing slight differences in performance. Despite the difference being insignificantly low, the uproar from users prompted Apple to issue a statement regarding the matter.
Chipworks’ A10 Fusion die photo reveals a die part number of TMGK98 (continued from A9’s TMGK96), and the die size, which is ~125 sq. mm. Given the thinness of the chip, Chipworks suspects that Apple may have used TSMC’s InFO packaging technique.
The Chipworks teardown brings more tidbits of Apple’s component choices, and you can read more here.