Apple’s next-generation iPhone could include Qualcomm’s MDM9625 LTE modem, with support for LTE-Advanced.
MacRumors has released an image of what could be the logic board on the 4.7-inch model iPhone 6. The below image reportedly shows a part of the iPhone 6’s logic board, housing the A8 processor and MDM9625 LTE modem (outlined in the red box).
The MDM9625 LTE modem, based on a 28-nanometer production process, can provide speeds of up to 150Mbps and improved LTE networking. The new chip could provide the next-generation iPhone with a significant increase in LTE performance.
Part of the speed benefits of the MDM9625 and new LTE-Advanced technology compared to earlier generations of modems comes from the use of carrier aggregation to combine channels for greater bandwidth. With the MDM9625, this carrier aggregation requires a pair of companion chips, a WTR1625L transceiver chip and a WFR1620 chip. These chips appear to be located on the opposite of the iPhone 6 logic board from the LTE modem itself.
Earlier today we saw leaks which showed the iPhone 6’s logic board with the A8 chip, 1GB of RAM, and 16GB of flash storage. Other leaks include a iPhone 6 connected to iTunes on a Mac, as well as an alleged image of the 5.5-inch iPhone 6’s rear shell.
Apple is expected to launch the iPhone 6 at an event planned for September 9. The company’s next-generation smartphone is rumoured to come in two display sizes, a 4.7-inch model and a 5.5-inch model.